| 27 AUG 2026 |
StratEdge Opens New Facility in Poway |
| 01 JUL 2026 |
StratEdge Gold Plated Tabs for High-Power Semiconductors |
| 15 MAY 2026 |
StratEdge Takes High-Reliability Packaging on the Road for CSMantech, Space Tech Expo USA, and IMS 2026 |
| 01 MAY 2026 |
StratEdge Honored with a Partner 2 Win Gold Tier Award from BAE Systems |
| 07 APR 2026 |
StratEdge Brings Gold Plated Tab and Packaging Expertise to CMSE 2026 |
| 26 FEB 2026 |
StratEdge Powers Up for 2026: Showcasing Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech |
| 12 NOV 2025 |
StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec, Read here: English | Japanese Translation |
| 23 SEP 2025 |
StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS |
| 12 JUN 2025 |
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336 |
| 06 MAY 2025 |
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA |
| 10 APR 2025 |
From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE |
| 25 FEB 2025 |
StratEdge Power Up for 2025: Showcasing the Latest Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech Conferences |
| 21 JAN 2025 |
StratEdge Corporation Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York |
| 21 NOV 2024 |
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award |
| 31 OCT 2024 |
Coastal RF Systems Joins StratEdge's Network as Manufacturer's Representative for Southern California |
| 17 OCT 2024 |
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024 |
| 10 SEP 2024 |
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium |
| 13 AUG 2024 |
StratEdge Brings Gold Medal Performance with its Molded Ceramic and Post-fired Ceramic Packages, and High-reliability Assembly Services |
| 13 JUN 2024 |
StratEdge High-Performance Semiconductor Packages to be on Display at IMS 2024 Booth 515 |
| 29 APR 2024 |
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events |
| 07 MAR 2024 |
StratEdge Brings Packaging Innovation to IMAPS Device Packaging |
| 15 FEB 2024 |
No Redesign Required: StratEdge Revives Critical Hybrid Packages |
| 14 SEP 2023 |
StratEdge Reveals High-Performance Semiconductor Packages at European Microwave Week, IMAPS International, and IEEE BCICTS |
| 22 AUG 2023 |
StratEdge Presents Hermetic Molded Ceramic Packages at European Microwave Week in Berlin |
| 07 JUN 2023 |
StratEdge Semiconductor Packages at IMS: Powering the Future of Technology |
| 14 MAR 2023 |
Breaking the Limits: StratEdge Pushes High-Temperature Packaging Technology to the Extreme at Upcoming Events |
| 03 MAR 2023 |
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences |
| 26 JAN 2023 |
StratEdge Improves Performance of Leaded Power Amplifier Packages, Now Supporting DC to 28GHz Devices |
| 17 NOV 2022 |
StratEdge Glass Side Wall Packages: Straightforward Packaging Solutions for Mil-Std Applications |
| 28 SEP 2022 |
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices |
| 08 SEP 2022 |
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs |
| 16 JUN 2022 |
StratEdge Displays High-Performance Semiconductor Packages at IMS 2022, June 21-23, in Booth 4089 |
| 18 MAY 2022 |
Getting a Reliable Signal: StratEdge's High-Performance Power Amplifier Packages |
| 04 MAY 2022 |
StratEdge High-Power Semiconductor Packages will be Featured at CS MANTECH in Monterey, California |
| 02 MAR 2022 |
StratEdge to Display Post-fired, Molded Ceramic, and Ceramic QFN Semiconductor Packages at the IMAPS Device Packaging, APEC 2022, and GOMACTech Conferences |
| 30 SEP 2021 |
StratEdge to Present Glass Sidewall for Power Semiconductors and Ceramic Packages for 5G at IMAPS 2021 Live |
| 07 JUN 2021 |
StratEdge High-performance Semiconductor Packages to be on Display at IMS2021, June 8-9, in Booth 1014 |
| 27 APR 2021 |
StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices |
| 10 MAR 2021 |
StratEdge Announces Increased Manufacturing Capacity of Small Outline Glass Sidewall Thermally Enhanced Packages for Power Semiconductors |
| 04 FEB 2021 |
Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet |
| 18 NOV 2020 |
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications |
| 05 OCT 2020 |
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020 |
| 21 SEP 2020 |
StratEdge Reports A Strong Third Quarter |
| 06 AUG 2020 |
StratEdge White Paper, "Eutectic Die Attach Optimizes High Power GaN Devices," is Now Available |
| 06 JUN 2020 |
StratEdge Expands Production Capacity of its RF Packaging Line |
| 20 MAR 2020 |
COVID-19 Coronavirus Update: StratEdge is open for business.
|
| |
StratEdge Features its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March |
| |
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs |
| |
StratEdge Expands Packaging and Assembly Services for High-Frequency and High-Power Devices |
| |
StratEdge High-Frequency and High-Power Packages and Assembly Services to be Featured at IMAPS and European Microwave Week 2019 Events |
| |
StratEdge President and CEO Tim Going Selected as a Finalist for the 2019 CEO of the Year Award |
| |
StratEdge High-performance Semiconductor Packages to be on Display at IMS2019, June 4-6, in Booth 361 |
| |
StratEdge High-frequency, Thermally-efficient Packages for Compound Semiconductors to be Featured at CS ManTech |
| |
StratEdge to Display Post-fired, Molded Ceramic, and Ceramic QFN Semiconductor Packages at the IMAPS Device Packaging, APEC 2019, and GOMACTech Conferences |
| |
StratEdge Selects Casey Krawiec as Vice President of Global Sales |
| |
StratEdge to Display GaN and GaAs Packages at IMAPS, BCICTS, and EDI CON USA |
| |
StratEdge Receives ISO 9001:2015 Quality Management Systems Certification |
| |
StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649
|
| |
StratEdge to Display High-Temperature and High-Reliability Packages at CS ManTech and IMAPS HiTEC Conferences |
| |
StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62 |
| |
Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS |
| |
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements |
| |
Marty Daniel Joins StratEdge as Account Manager |
| |
StratEdge Introduces New, Mobile-Friendly Website |
| |
StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices |
| |
StratEdge Semiconductor Packages Now Sold on Amazon.com |
| |
StratEdge Introduces High-frequency Surface Mount Package |
| |
StratEdge Introduces Low-profile, High-power Switch Package
|
| |
StratEdge Introduces Family of X-Band High Power Amplifiers in Surface Mount Packages
|
| |
StratEdge Unveils Series of Small Outline Thermally Enhanced Packages for Power Semiconductors
|
| |
StratEdge Announces Success of Employee Vanpool Transportation Program
|
| |
StratEdge Moves to New San Diego Facilities
|
| |
StratEdge SMT Molded Ceramic Packages Support Frequencies of DC to 20 GHz
|
| |
StratEdge Announces New Package Line to Support Power Applications
|
| |
StratEdge SMX Surface Mount Packages Support DC to 18GHz Devices
|
| |
StratEdge Power Amplifier Package Used on Mars Rovers
|
| |
StratEdge Introduces Low Cost Hermetic Semiconductor Packages for Switch Applications
|
| |
Casey Krawiec Promoted to StratEdge VP North American Sales
|
| |
StratEdge, J microTechnology, and Accel-RF Host MMIC Packaging, Testing and Reliability Seminar at MTT-S
|
| |
StratEdge High Frequency Package Chosen for Device Life Testing in Accel-RF Equipment
|
