Visit StratEdge at these events to see the latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices. StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 20 years. With a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.

IMAPS 2018 - Booth 309
October 9-10, 2018 - Pasadena Convention Center

2018 IEEE BiCMOS and Compound Integrated Circuits and Technology Symposium (BCICTS) - Booth 4
October 14-17, 2018 - Sheraton San Diego Hotel and Marina in San Diego, California

EDI CON USA 2018 - Booth 224
October 17-18, 2018 - Santa Clara Convention Center, Santa Clara, CA

IMAPS Device Packaging
March 5-6, 2019 - WekoPa Resort, Fountain Hills, Arizona