StratEdge to Display Post-fired, Molded Ceramic, and Ceramic QFN Semiconductor Packages at the IMAPS Device Packaging, APEC 2019, and GOMACTech Conferences
StratEdge Assembly Services to be highlighted
Photo available at: https://www.stratedge.com/stratedge-at-imaps-apec-gomactech.png
San Diego, CA – 4 March 2019 – StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will display its high-frequency, high-speed, thermally efficient packages and assembly packaging services at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all being held in March. StratEdge's packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
StratEdge will showcase its post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages at booth 63 at the IMAPS Device Packaging Conference, being held March 5-6, at the We-Ko-Pa Resort in Fountain Hills, Arizona. Also highlighted will be StratEdge Assembly Services and its new ISO 9001:2015 facility with a Class 1000 cleanroom, including Class 100 work areas with ESD control for performing sensitive operations.
High-power semiconductor package design and assembly will be StratEdge's focus at booth 148 at APEC 2019, being held at the Anaheim Convention Center in Anaheim, California from March 19-20, 2019. On display will be the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully-hermetic versions in over 200 standard outlines.
High-reliability packages that meet stringent military applications will be at booth 205 at GOMACTech, being held March 26-27 at the Albuquerque Convention Center, Albuquerque, New Mexico. StratEdge post-fired and molded ceramic semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.
"Our goal at StratEdge is not only to provide the highest quality and reliability packages and packaging assembly services," said Tim Going, president of StratEdge, "but we want to ensure that the package a customer selects is the best one for the device that's packaged and the application. StratEdge attends a full range of trade shows throughout the world to enable as many people as possible to see our packages and discuss their packaging needs with our experts."
StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly services. We specialize in packages for high-frequency, very high power, extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. We have a complete line of post-fired, molded ceramic, and ceramic QFN semiconductor packages that operate from DC to 63+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 63+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS. StratEdge is an ISO 9001:2015 facility.