The hermetic SMT package line is intended for applications that where a QFN standard outline is preferred, but the performance and reliability provided in a fully hermetic air cavity configuration is required. This series is available in several standard outlines ranging from 3X3 mm to 8X8 mm, with multiple pad counts in each configuration.
These packages can be provided with several different lid options, including conventional gold plated combo lids and low temperature seal glass ceramic lids. Multiple base options are also available including high thermal conductivity bases for power semiconductor applications and ceramic bottoms where electrical isolation of the die is required.
Please contact the factory for additional information on specific outlines and performance criteria.