Assembly and Test Services Division

StratEdge Assembly and Test Services Division assemble and test single- and multi-chip MMIC and fiber optic devices into StratEdge packages, using eutectic or epoxy die and passive component attach and automatic wire bonding.


After assembly, the packages are lidded, leads trimmed and formed, and then tested with a HP 8510C network analyzer at up to 50 GHz. Post assembly services include labeling, bulk packaging, and preparation for delivery. StratEdge can accommodate special requests such as grouping completed parts based on very tight electrical performance specifications so they can be used together in specific applications.


Overview:

StratEdge has offered assembly and test services of DC to 50 GHz packages since 2000. The assembly process includes eutectic or epoxy die and passive component attach with automatic wire bonding. After assembly, the packages are lidded, leads trimmed and formed, and then tested with a HP8510C network analyzer. Post assembly services include labeling and bulk packaging including tape and reel. StratEdge can accommodate special requests such as grouping completed parts based on very tight electrical performance specifications. We assemble in our 5,000 Sq Ft clean room with sensitive operations performed in a class 100 work area. StratEdge is a ISO 9001:2000 facility.

Equipment:

Component Attach:

• 2 ea...........Mullen Equipment Company manual eutectic die bonders
• 1 ea...........Yield Engineering Glen-R3A multi-rack RF plasma cleaner
• 1 ea...........March Instruments PM-600 single rack RF plasma cleaner
• 1 ea...........Westbond 7200A semi-automatic epoxy attach machine
• 1 ea...........Blue M 0V-18A forced convection drying oven
• 1 ea...........Blue M DC-4580 curing oven
• 1 ea...........Automated die attach equipment 
• 1 ea...........Hybond Model UDB-141 Semiautomatic Eutectic Die Bonder

Wire Bonding:

• 2 ea...........K&S 1474 fully automatic gold wedge wire bonders w/ pattern recognition software and boat and magazine handling equipment
• 1 ea...........Hybond 572 manual gold wedge wire bonder

Test and Inspection:

• 1 ea...........Hewlett Packard 8510C Network Analyzer
• 4 ea...........Hewlett Packard HP E3610A DC power supply
• 1 ea...........Hewlett Packard E3631A computer controlled DC power supply.
• 1 ea...........Hewlett Packard 34401A computer controlled multimeter
• 1 ea...........Westbond 70PT wire bond pull tester
• 1 ea...........Anritsu 3680K Universal Test Fixture 
• 1 ea...........American Optical training microscope
• 1 ea...........Accu-scope 90X max microscope
• 2 ea...........67.5X max microscope
• 1 ea...........microview automated inspection

Trim, Form, and Marking:

• 1 ea...........Printex G2-60 pad transfer printer
• 1 ea...........Dayton 4TJ92 manual arbor press (used for lead Trim/Form)
• 1 ea...........Otto Engineering OTTO-DOT A4S1
• 1 ea...........Pneumatic horizontal press (used for lead Trim/Form)
• 1 ea...........Pneumatic vertical press (used for lead Trim/Form)