Package Assembly

APPLICATION NOTE:
SMX - Package Assembly

Wire/Ribbon Bonding and Test: StratEdge SMX packages feature Nickel - Gold plated metallization, and are designed to match with a raised ceramic cap using an epoxy preform. Conventional wedge bonding is recommended for optimal chip performance. Packages can be attached to the next circuit level by surface mount procedures. Terminate unused RF I/Os to the base to minimize coupling.

Cleaning: Although all packages are thoroughly cleaned before shipment, if additional cleaning is desired, the recommended procedure is the use of a commercial organic degreaser followed by acetone and isopropyl alcohol.

Rework: If components need to be removed from the package, the package should not be heated above 400°C.

For further assistance, contact Applications Engineering @ 866-424-4962, or by e-mail at Applications@StratEdge.com

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