Package Assembly

APPLICATION NOTE :
SEC & SEC40 Packages

Wire/Ribbon Bonding and Test. All circuit metallization is both wire and ribbon bondable. Gap welding is compatible with this material set, but soldering is not compatible with the I/O material. The plated metal base is solderable. StratEdge recommends using electrical test connectors or probes that make a pressure contact with the strip conductor of the substrate. Connectors that slide across the conductor are not recommended since they could damage the package. All unused RF I/Os should be terminated to the base to minimize coupling.

Cleaning: Although all packages are thoroughly cleaned before shipment, the recommended cleaning procedure is the use of a commercial organic degreasing solution, followed by acetone and isopropyl alcohol. Cleaning procedures that use acid or alkaline solutions are not recommended.

Rework: If components need to be removed from the package, the package should not be heated above 300°C.

For further assistance, contact Applications Engineering @ 866-424-4962, or by e-mail at Applications@StratEdge.com

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