APPLICATION NOTE :
SEC & SEC40 Packages
Wire/Ribbon Bonding and Test. All
circuit metallization is both wire and ribbon bondable.
Gap welding is compatible with this material set, but soldering
is not compatible with the I/O material. The plated metal
base is solderable. StratEdge recommends using electrical
test connectors or probes that make a pressure contact with
the strip conductor of the substrate. Connectors that slide
across the conductor are not recommended since they could
damage the package. All unused RF I/Os should be terminated
to the base to minimize coupling.
Cleaning: Although all packages are
thoroughly cleaned before shipment, the recommended cleaning
procedure is the use of a commercial organic degreasing
solution, followed by acetone and isopropyl alcohol. Cleaning
procedures that use acid or alkaline solutions are not recommended.
Rework: If components need to be
removed from the package, the package should not be heated
For further assistance, contact Applications
Engineering @ 866-424-4962, or by e-mail at Applications@StratEdge.com