Bonding and Test
StratEdge uses Strat-E-Film™, a proprietary materials set
to provide superior package performance. Wedge bonding is
recommended for optimal performance. Gap welding is compatible
with this material set, but soldering is not compatible
with the I/O material. The plated metal base is solderable.
StratEdge recommends using electrical test connectors or
probes that make a pressure contact with the strip conductor
of the substrate. Connectors that slide across the conductor
are not recommended since they could damage the package.
All circuit metalization passes Mil-Std-883 adhesion requirements
and is both wire and ribbon bondable. All unused RF I/Os
should be terminated to the base to minimize coupling.
Although all packages are thoroughly cleaned before shipment,
the recommended cleaning procedure is the use of a commercial
organic degreasing solution, acetone and isopropyl alcohol.
Cleaning procedures that use acid or alkaline solutions
are not recommended.
If components need to be removed from the package, the package
should not be heated above 300°C.
feel free to contact the factory for further assistance.