Package Assembly

Wire/Ribbon Bonding and Test
StratEdge uses Strat-E-Film™, a proprietary materials set to provide superior package performance. Wedge bonding is recommended for optimal performance. Gap welding is compatible with this material set, but soldering is not compatible with the I/O material. The plated metal base is solderable. StratEdge recommends using electrical test connectors or probes that make a pressure contact with the strip conductor of the substrate. Connectors that slide across the conductor are not recommended since they could damage the package. All circuit metalization passes Mil-Std-883 adhesion requirements and is both wire and ribbon bondable. All unused RF I/Os should be terminated to the base to minimize coupling.

Cleaning Procedure
Although all packages are thoroughly cleaned before shipment, the recommended cleaning procedure is the use of a commercial organic degreasing solution, acetone and isopropyl alcohol. Cleaning procedures that use acid or alkaline solutions are not recommended.

Rework
If components need to be removed from the package, the package should not be heated above 300°C.

Please feel free to contact the factory for further assistance.

Go Back