SE-20, MC Series Lid Attach
Solder Lid Attachment Procedure
The lids supplied with the SE20 and MC Series packages are nickel and
gold plated Kovar™ with an attached AuSn eutectic preform.
The recommended method of attachment is by solder flow.
The profile should provide a peak of 300°C - 315°C. The
peak should remain above 280°C for 1 - 2 minutes with a
preheat cycle time of 3 - 4 minutes. The type of atmosphere
used should be either reducing (forming gas) or protective
(nitrogen). StratEdge uses two-pound clamps to position
the lid. A process should be developed and optimized with
the specific equipment at your facility. Results will vary
1. The type of furnace employed: a) Amount
of heated length, b) Belt speed, c) Stability of atmospheric
flows within, and d) Other physical characteristics such
as belt width.
2. The size and mass of the assembled part and fixturing
(used to keep the lid aligned) in combination. More overall
mass requires more heat.
3. The clamping force or amount of weight used. The weight
must be sufficient to insure proper bonding, but not so
great as to force the solder out of the joint. This can
be accomplished with weights, spring clips, or other types
of clamps. Two-pound spring clips (per package) have been
found to provide satisfactory results.
Cleaning of lids with solder preforms is not recommended.
If components need to be removed from the package, the package
should not be heated above 300°C.
Please feel free to contact the factory
for further assistance.