Package Assembly

APPLICATION NOTE:
Leaded Power Amplifier (LPA) Packages - Plastic Cap Configuration

Wire/Ribbon Bonding and Test: StratEdge LPA packages feature Nickel - Gold plated metallization, and are designed to match with a raised plastic cap using an epoxy preform. Conventional wedge bonding is recommended for optimal chip performance, and soldering is recommended for the lead attachment. Typical leads are .010" wide X .005" thick. Extra care in handling is advised, especially if your facility is accustomed to larger leads. Terminate unused RF I/Os to the base to minimize coupling.

Cleaning: Although all packages are thoroughly cleaned before shipment, if additional cleaning is desired, the recommended procedure is the use of a commercial organic degreaser followed by acetone and isopropyl alcohol.

Rework: If components need to be removed from the package, the package should not be heated above 400°C.

For further assistance, contact Applications Engineering @ 866-424-4962, or by e-mail at Applications@StratEdge.com


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