Mounting LPAs On Circuit Boards
Mounting assembled Leaded Power Amplifier (LPA) Packages
onto circuit boards.
Special design considerations allow the
LPA Packages to operate at high frequency. LPA packages
feature leads attached to an alumina ceramic body with one
of the strongest ceramic to metal joints available. One
element required for operation at high frequency is the
use of fine geometry leads. Fine geometry leads are not
as robust, and it is possible to exceed the yield or tensile
strength even with small hand tools. Even though firmly
attached, EXTRA care in handling is essential.
Check all fixtures used for assembly, for
lead form, and for test to be sure that parts are not subjected
to unnecessary physical stress.
Check that fixtures allow for proper tolerance
Check that test sockets are easy to load,
and not likely to torque or twist the leads.
For packages that mount with screws, be
sure that the package is attached to a flat surface.
Do not over-torque mounting screws.
Do not use conductive gaskets or shims under
Do not use test fixtures or sockets that
may produce a sharp lifting force to lift the lead directly
adjacent to the package.
If packages must be removed after solder
attach, do not pry the leads up so that the force lifting
the lead from the board is also lifting the lead from the
package. Use a probe to press down on the lead-to-package
joint, and lift the lead when the solder is fluid.