Assembly and Test Services

StratEdge assembly and test services assemble and test single- and multi-chip MMIC and fiber optic devices into StratEdge packages, using eutectic or epoxy die and passive component attach and automatic wire bonding.

After assembly, the packages are lidded, leads trimmed and formed, and then tested with a HP 8510C network analyzer at up to 50 GHz. Post assembly services include labeling, bulk packaging, and preparation for delivery. StratEdge can accommodate special requests such as grouping completed parts based on very tight electrical performance specifications so they can be used together in specific applications.